Dong, G. et al. Passivation of high aspect ratio silicon nanowires by using catalytic chemical vapor deposition for radial heterojunction solar cell application. RSC Adv.7, 45101–45106 (2017).
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Runoff Potential Index (RPI): 3D modelling of surface-driven hydrological dynamics for drought resilience
Runoff Potential Index (RPI): 3D modelling of surface-driven hydrological dynamics for drought resilience
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An intelligent hybrid deep learning-machine learning model for monthly groundwater level prediction
Tao, H. et al. Groundwater level prediction using machine learning models: A comprehensive review. Neurocomputing 489, 271–308 (2022).
Sun, J., Hu, L., Li, D., Sun, K. & Yang, Z. Data-driven…
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Mimicking opioid analgesia in cortical pain circuits
Sample sizes
The sample sizes were not statistically determined before the experiments. Rather, the group sizes were on the basis of published literature for the type of manipulation (chemogenetics, site-specific genetic knockout and pharmacology)…
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Enhanced confocal microscopy with physics-guided autoencoders via synthetic noise modeling
McLeod, E. & Ozcan, A. Unconventional methods of imaging: computational microscopy and compact implementations. Rep. Prog. Phys. 79 (7), 076001 (2016).
Fischer, R. S., Wu, Y., Kanchanawong, P.,…
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Global firms choose to invest in well-connected airport cities
Publisher’s note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
This is a summary of: Amico, A. et al. Air connectivity boosts urban attractiveness for global firms. Nat….
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Design of low power and high speed approximate multipliers utilizing current mode 4 to 2 compressors based on CNTFET technology
Liang, J., Han, J. & Lombardi, F. New metrics for the reliability of approximate and probabilistic adders. IEEE Trans. Comput. 62, 1760–1771 (2012).
Han, J. & Orshansky, M. Approximate…
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A call to re-collectivize science and make it more equitable
I suggest that we take steps to re-collectivize science. Scientific practice, built on colonial and capitalist standards, promotes individualism and separates senior researchers from young researchers, pitting us against each other in an eternal…
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High-frequency characteristics analysis and optimization of coaxial-like TGVs
Shen, W.-W. & Chen, K.-N. Three-dimensional integrated circuit (3D IC) key technology: Through-silicon via (TSV). Nanoscale Res. Lett. 12, 56 (2017).
Kiran, K. M., Kaushik, B. K. & Dhiman, R….
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