Design and development of flexible sensing patch
To precisely decode flight parameters, we designed and developed a wing-integrated flexible electronic sensing patch with bimodal pressure and velocity aerodynamic sensing capabilities, as…
To precisely decode flight parameters, we designed and developed a wing-integrated flexible electronic sensing patch with bimodal pressure and velocity aerodynamic sensing capabilities, as…
The FT-IR spectrum displays multiple necessary vibrational signatures associated with the EC composite. A minor peak at 1374 cm− 1 signifies the presence of methyl vibrations, which are associated with the -CH3 stretching…
The biomolecule BSA was employed as a chiral additive to induce the twisted side-by-side self-assembly of cetyltrimethylammonium bromide (CTAB)-stabilized GNDs in solution to form chiral assemblies (Fig. 1a)….
The human brain, with its 1011 neurons interconnected by 1015 synapses, functions as a highly complex and adaptable system capable of continuous self-reconfiguration3….
As presented in Fig. 1a and Supplementary Fig. 2, Cs2NaLuCl6(Sb) has a typical 3D double perovskite crystal structure, where [LuCl6]3− octahedron and [NaCl6]5− octahedron are separated…
Animal handling was performed following approval from the Ethics Committee for Animal Experimentation. The different protocols including animals were approved by the Ministry of Higher Education, Research and Innovation of…
Researchers created an ultra-thin optical array that controls photons like bulky quantum devices, offering a scalable path to room-temperature quantum photonics.
Researchers grow single-crystal GaN films on amorphous glass using a chemically converted molybdenum nitride buffer, removing the need for crystalline substrates in epitaxy
Researchers develop a simple method to build stable, atom-thick metal layers using tiny defects in carbon, enabling efficient use of metals across technologies.
Twisted 2D bilayers show angle dependent atomic vibrations, revealing how misalignment affects heat flow and aiding design of heat resistant electronics.