Device fabrication
The bottom control gates (5/15 nm Cr/Au) were patterned by e-beam lithography with a bilayer photoresist process followed by deposition of metal by e-beam evaporation on silicon dioxide (300 nm)/silicon substrates. For the…
The bottom control gates (5/15 nm Cr/Au) were patterned by e-beam lithography with a bilayer photoresist process followed by deposition of metal by e-beam evaporation on silicon dioxide (300 nm)/silicon substrates. For the…